Composite electronic component, method of manufacturing the same, board for mounting thereof, and packaging unit thereof

ABSTRACT

A composite electronic component composed of a composite body including a capacitor and an electrostatic discharge (ESD) protection device coupled to each other. The capacitor includes a ceramic body in which a plurality of dielectric layers and internal electrodes are stacked with a respective dielectric layer therebetween. The ESD protection device includes first and second electrodes disposed on the ceramic body, a discharging part disposed between the first and second electrodes, and a protective layer disposed on the first and second electrodes and the discharging part. An input terminal disposed on a first end surface of the composite body and is connected to internal electrodes and the first and second electrodes. A ground terminal formed on a second end surface of the composite body and is connected to internal electrodes and the first and second electrodes.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Korean Patent Application No.10-2014-0063094 filed on May 26, 2014, with the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference.

BACKGROUND

This disclosure relates to a composite electronic component including aplurality of passive devices, a method of manufacturing the same, aboard for mounting thereof, and a packaging unit thereof.

Recently, in accordance with rapid development of the semiconductorindustry, ultra-high integration of integrated circuits (ICs) forminiaturization of and improvements in levels of performance thereof hasbeen attempted, and as such it has been somewhat difficult to addressthe problem of electrostatic discharge (ESD) in these untra-miniaturizedICs. Therefore, a need to use an electrostatic discharge protectiondevice in power and signal input terminals of such ICs has increased.

In accordance with the gradual increase in the data rates of portableproducts such as mobile phones, digital cameras, and personal digitalassistants (PDA), high speed data lines, universal serial bus (USB)lines, high definition multimedia interface (HDMI) lines, and the like,countermeasures against electrostatic discharge (ESD) have increased inimportance.

In addition, products such as vehicles, televisions (TV), and the like,require connectors for interconnecting connection cables betweenelectronic boards. Since such connectors may be easily touched by aworker in a manufacturing process or by a device user, countermeasuresagainst noise and ESD in such connectors are very important in order toimprove product reliability.

As a component for preventing ESD, a multilayer ceramic capacitor(MLCC), a transient voltage suppression (TVS) diode, a varistor, an ESDsuppressor, or the like, has been used alone or parallel connections ofsuch components have been used.

In this case, an area in which components are disposed in an electronicapparatus is inevitably increased, which may limit the miniaturizationof electronic apparatuses.

Further, it is difficult to secure electrical characteristics such asnoise filtering characteristics, unique to MLCCs, in components otherthan MLCCs. Therefore, it is rare to use components other than MLCCsalone, except in the case of ultrahigh frequency communicationsterminals.

SUMMARY

Described herein are a composite electronic component capable of beingmounted in a decreased area, a method of manufacturing the same, a boardfor mounting thereof, and a packaging unit thereof.

The composite electronic component, in accord with embodiments of thisdisclosure, comprises a capacitor having a body in which are locatedinternal electrodes separated by dielectric material; an electrostaticdischarge (ESD) protection device disposed on the body of the capacitorand having electrodes coupled to the internal electrodes of thecapacitor, the ESD having a discharge part and first and secondelectrodes at opposite portions of the discharge part; and input andground terminals coupled to the first and second electrodes of the ESD.

In some embodiments, the composite electronic component may moreparticularly include a composite body including a capacitor and anelectrostatic discharge (ESD) protection device coupled to each other,the capacitor including a ceramic body in which a plurality ofdielectric layers and internal electrodes disposed to face each otherwith a respective dielectric layer interposed therebetween are stacked,the ESD protection device including first and second electrodes disposedon the ceramic body, a discharging part disposed between the first andsecond electrodes, and a protective layer disposed on the first andsecond electrodes and the discharging part.

The ESD protection device may be disposed on a lower surface of theceramic body.

In some embodiments, a composite electronic component may include acomposite body in which a noise filter unit and an ESD protection devicedisposed below the noise filter unit coupled to each other, and an inputterminal and a ground terminal are coupled to the composite body. Thenoise filter unit may filter a noise component of an input signal to theinput terminal, and the ESD protection device may bypass anyover-voltage above a rated voltage input to the input terminal.

According to some embodiments, a board for mounting of a compositeelectronic component may include a printed circuit board on which aplurality of electrode pads are disposed, the composite electroniccomponent as described above installed on the printed circuit board, andsolder connecting the electrode pads and the composite electroniccomponent to each other.

According to some embodiments, a packaging unit of a compositeelectronic component may include the composite electronic components asdescribed above disposed so that ESD protection devices thereof aredirected toward bottom surfaces of receiving parts, and a packagingsheet having the receiving parts formed therein, the receiving partsreceiving the composite electronic components therein.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features and other advantages of thepresent disclosure will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a transparent perspective view schematically illustrating acomposite electronic component according to a first exemplary embodimentin the present disclosure;

FIG. 2 is a cross-sectional view taken along line A-A′ of FIG. 1;

FIG. 3 is a perspective view schematically illustrating a compositeelectronic component according to a second exemplary embodiment in thepresent disclosure;

FIG. 4 is a cross-sectional view taken along line A-A′ of FIG. 3;

FIG. 5 is an equivalent circuit diagram of the composite electroniccomponent illustrated in FIG. 3;

FIG. 6 is a perspective view schematically illustrating a compositeelectronic component according to a third exemplary embodiment in thepresent disclosure;

FIG. 7 is a cross-sectional view taken along line A-A′ of FIG. 6;

FIG. 8 is a perspective view schematically illustrating a compositeelectronic component according to a fourth exemplary embodiment in thepresent disclosure;

FIG. 9 is a cross-sectional view taken along line A-A′ of FIG. 8;

FIG. 10 is a view illustrating a signal interface through which signalsare transferred from a connector to a system or an integrated circuit(IC);

FIG. 11 is a view illustrating a pattern for a layout of a devicebetween a connector and a system or an IC;

FIG. 12 is a circuit diagram of the composite electronic componentaccording to an exemplary embodiment in the present disclosure;

FIG. 13 is a view illustrating a device layout pattern in which thecomposite electronic components according to an exemplary embodiment inthe present disclosure are used between a connector and a system or anIC;

FIG. 14 is a perspective view illustrating a manner in which thecomposite electronic component of FIG. 8 is mounted on a printed circuitboard;

FIG. 15 is a schematic perspective view illustrating a manner in whichthe composite electronic components of FIG. 8 are mounted in a packagingunit; and

FIG. 16 is a schematic cross-sectional view illustrating a packagingunit of FIG. 15 coiled in a coil shape.

DETAILED DESCRIPTION

Hereinafter, embodiments of the inventive concepts presented in thisdisclosure will be set forth in detail with reference to theaccompanying drawings. The disclosure may, however, express inventivesubject matter embodied in many different forms and should not beconstrued as being limited to the embodiments set forth herein. Rather,these embodiments are provided so that this disclosure will be thoroughand complete, and will fully convey the scope of the disclosure to thoseskilled in the art. In the drawings, the shapes and dimensions ofelements may be exaggerated for clarity, and the same reference numeralswill be used throughout to designate the same or like elements.

Composite Electronic Component

Hereinafter, exemplary embodiments in the present disclosure will be setforth in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view schematically illustrating a compositeelectronic component according to a first exemplary embodiment in thepresent disclosure.

FIG. 2 is a cross-sectional view taken along line A-A′ of FIG. 1.

In the composite electronic component according to an exemplaryembodiment in the present disclosure, a ‘length direction’ refers to an‘L’ direction of FIG. 1, a ‘width direction’ refers to a ‘W’ directionof FIG. 1, and a ‘thickness direction’ refers to a ‘T’ direction ofFIG. 1. Here, the ‘thickness direction’ refers to a direction in whichdielectric layers of a capacitor are stacked, for example, a ‘stackingdirection’.

Meanwhile, the length direction, the width direction, and the thicknessdirection of the composite electronic component may be the same as thoseof a capacitor and an electrostatic discharge (ESD) protection device,as described below.

In addition, in an exemplary embodiment of the present disclosure, thecomposite electronic component may have upper and lower surfacesopposing each other, and first and second end surfaces connecting theupper and lower surfaces to each other in the length direction and thirdand fourth side surfaces connecting the upper and lower surfaces to eachother in the width direction. The shape of the composite electroniccomponent is not particularly limited, but may be a hexahedral shape asshown in the drawings.

In addition, the first and second end surfaces of the compositeelectronic component in the length direction and the third and fourthside surfaces thereof in the width direction may be the same as firstand second end surfaces of a capacitor and an electrostatic discharge(ESD) protection device in the length direction and third and fourthside surfaces thereof in the width direction, respectively, as describedbelow.

Meanwhile, the composite electronic component may have a form in whichthe capacitor and the ESD protection device are coupled to each other.In the case in which the ESD protection device is coupled to a lowerportion of the capacitor, an upper surface of the composite electroniccomponent refers to an upper surface of the capacitor, and a lowersurface of the composite electronic component refers to a lower surfaceof the ESD protection device.

Referring to FIGS. 1 and 2, a composite electronic component 100according to a first exemplary embodiment of the inventive conceptsherein may include a composite body 130 including a capacitor 110 and anelectrostatic discharge (ESD) protection device 120 coupled to eachother, the capacitor 110 being configured of a ceramic body in which aplurality of dielectric layers 111 and internal electrodes 121 and 122disposed so as to face each other with a respective dielectric layer 111interposed therebetween are stacked; and the ESD protection device 120including first and second electrodes 141 and 142 disposed on theceramic body, a discharging part 140 disposed between the first andsecond electrodes 141 and 142, and a protective layer 150 disposed onthe first and second electrodes 141 and 142 and the discharging part140.

In the exemplary embodiment presented in the present disclosure, thecomposite body 130 may be formed by coupling the capacitor 110 and theESD protection device 120 to each other. However, a method of formingthe composite body 130 is not particularly limited.

For example, the composite body 130 may be formed by coupling thecapacitor 110 and the ESD protection device 120, separatelymanufactured, with a conductive adhesive, a resin, or the like, or maybe formed by sequentially disposing the first and second electrodes 141and 142, the discharging part 140, and the protective layer 150 on theceramic body configuring the capacitor 110, but is not particularlylimited thereto.

According to the first exemplary embodiment in the present disclosure,the composite body 130 may be formed by sequentially disposing the firstand second electrodes 141 and 142, the discharging part 140, and theprotective layer 150 on the ceramic body configuring the capacitor 110.

Hereinafter, the capacitor 110 and the ESD protection device 120configuring the composite body 130 will be described in detail.

Referring to FIG. 2, the ceramic body configuring the capacitor 110 maybe formed by stacking a plurality of dielectric layers 111, and aplurality of internal electrodes 121 and 122 (first and second internalelectrodes) may be disposed in the ceramic body so as to be spaced apartfrom each other with a respective dielectric layer interposedtherebetween.

The plurality of dielectric layers 111 configuring the ceramic body 110may be in a sintered state, and adjacent dielectric layers may beintegrated, such that boundaries therebetween may not be readilyapparent.

The dielectric layer 111 may be formed by sintering a ceramic greensheet containing a ceramic powder, an organic solvent, and an organicbinder. The ceramic powder, a high k material, may be a barium titanate(BaTiO₃)-based material, a strontium titanate (SrTiO₃)-based material,or the like, but is not limited thereto.

Meanwhile, according to the first exemplary embodiment in the presentdisclosure, the internal electrodes may include first internalelectrodes 121 exposed to a first end surface of the composite body 130in the length direction and second internal electrodes 122 exposed to asecond end surface thereof in the length direction, but are not limitedthereto.

The first and second internal electrodes 121 and 122 may be formed usinga conductive paste containing a conductive metal.

The conductive metal may be nickel (Ni), copper (Cu), palladium (Pd), oralloys thereof, but is not limited thereto.

The first and second internal electrodes 121 and 122 may be printed onthe ceramic green sheets forming the dielectric layer 111, using aconductive paste by a printing method such as screen printing or gravureprinting.

The ceramic green sheets having the internal electrodes printed thereonmay be alternately stacked and sintered to form the ceramic body.

The capacitor may serve to filter a low frequency noise component in asignal interface, an integrated circuit (IC) block, or a communicationsline.

According to the first exemplary embodiment in the present disclosure,the ESD protection device 120 may be formed by sequentially disposingthe first and second electrodes 141 and 142, the discharging part 140,and the protective layer 150 on the ceramic body configuring thecapacitor 110.

Generally, as a component for preventing ESD, a multilayer ceramiccapacitor (MLCC), an ESD suppressor, or the like, has been used alone orin a state in which such components are connected to each other inparallel.

According to the first exemplary embodiment in the present disclosure,the composite electronic component may include the capacitor 110 and theESD protection device 120 coupled to each other.

The ESD protection device 120 may be an ESD suppressor, but is notlimited thereto.

Since the ESD protection device 120 according to an exemplary embodimentin the present disclosure is the ESD suppressor, it may be different interms of a structure and actions thereof from a varistor, due to thefollowing reason.

According to the first exemplary embodiment in the present disclosure,the first and second electrodes 141 and 142 may be disposed on the sameplane so as to face each other.

The varistor, a general electrical overstress (EOS) protection device,may include a zinc oxide as a raw material and have a form in whichpalladium (Pd) or silver (Ag) electrodes are stacked while facing eachother in the stacking direction with the zinc oxide disposedtherebetween.

However, according to the first exemplary embodiment in the presentdisclosure, the first and second electrodes 141 and 142 may be disposedon the same plane so as to face each other.

However, the first and second electrodes 141 and 142 are not limitedthereto, but may be disposed so that they partially face each other in athickness direction of the composite body 130.

The first and second electrodes 141 and 142 may be formed using aconductive paste containing a conductive metal.

The conductive metal may be nickel (Ni), copper (Cu), palladium (Pd), oralloys thereof, but is not limited thereto.

According to the first exemplary embodiment in the present disclosure,the first and second electrodes 141 and 142 may be printed on theceramic body using a conductive paste by a printing method such asscreen printing method or a gravure printing method.

The discharging part 140 may include a conductive polymer, but is notlimited thereto.

The conductive polymer may have characteristics of a non-conductor inthe case in which a signal voltage input from a signal interface throughwhich signals are transferred from a connector to a system or anintegrated circuit (IC), an IC block of a power supply terminal, or acommunications line corresponds to a rated voltage (circuit voltage)level, but may have characteristics of a conductor in the case in whichan over-voltage such as ESD, or the like, is instantaneously generated.

The first and second electrodes 141 and 142 may be short-circuited dueto the discharging part 140 having the characteristics of the conductorin the case of generation of an over-voltage such as ESD, or the like.

Therefore, the over-voltage such as ESD, or the like, may be bypassed toa ground through the ESD protection device 120, such that the signalinterface, the IC block, or the communications line may be protected.

The conductive polymer is not particularly limited, but may be, forexample, a silicone-based resin.

According to the first exemplary embodiment in the present disclosure,since the discharging part 140 may include the conductive polymer, thesilicone-based resin, the ESD protection device 120 needs to be coupledto an outer surface of the capacitor 110 and may not be disposed in thecapacitor 110.

The reason for this may be that the silicone based resin may beevaporated and removed in the case in which it is disposed in thecapacitor since the silicone based resin has a boiling pointsignificantly lower than a sintering temperature of the ceramic bodyrequired at the time of manufacturing the capacitor.

In addition, according to the first exemplary embodiment in the presentdisclosure, the ESD protection device 120 may bypass the over-voltagesuch as ESD, or the like, by the first and second electrodes 141 and 142and the discharging part 140 disposed between the first and secondelectrodes 141 and 142. However, the varistor may act as an insulator ata rated voltage and act as a variable resistor at the time of generationof the over-voltage to bypass the over-voltage.

According to the first exemplary embodiment in the present disclosure,the protective layer 150 may include an epoxy based resin.

In the ESD protection device 120, the protective layer 150 may serve toprotect the first and second electrodes 141 and 142 and the dischargingpart 140 disposed between the first and second electrodes 141 and 142from an external environment, and material of the protective layer 150is not particularly limited.

The protective layer 150 may include an epoxy based resin to protect thefirst and second electrodes 141 and 142 and the discharging part 140disposed between the first and second electrodes 141 and 142 from anexternal environment.

Since the ESD protection device 120 is coupled to the outer surface ofthe capacitor 110, the protective layer 150 may be a requisite componentfor protecting the ESD protection device 120 from an externalenvironment.

The composite electronic component according to the first exemplaryembodiment in the present disclosure may include an input terminal 131disposed on the first end surface of the composite body 130 in thelength direction and connected to the first internal electrodes 121 ofthe capacitor 110 and the first electrode 141 of the ESD protectiondevice 120, and a ground terminal 132 formed on the second end surfaceof the composite body 130 in the length direction and connected to thesecond internal electrodes 122 of the capacitor 110 and the secondelectrode 142.

The input terminal 131 and the ground terminal 132 may be connected tothe internal electrodes 121 and 122 of the capacitor 110, such that thecomposite electronic component may serve to filter a noise component ofan input signal.

In addition, the input terminal 131 and the ground terminal 132 may beconnected to the first and second electrodes 141 and 142 of the ESDprotection device 120, respectively, such that the composite electrodecomponent may bypass the over-voltage.

The input terminal 131 and the ground terminal 132 may be formed using aconductive paste containing a conductive metal.

The conductive metal may be nickel (Ni), copper (Cu), tin (Sn), oralloys thereof, but is not limited thereto.

The conductive paste may further contain an insulating material. Theinsulating material may be, for example, glass, but is not limitedthereto.

A method of forming the input terminal 131 and the ground terminal 132is not particularly limited. For example, the input terminal 131 and theground terminal 132 may be formed by dipping the composite body or maybe formed by a method such as a plating method, or the like.

In addition, although not shown, nickel/tin (Ni/Sn) plating layersformed by plating may be further disposed on outer portions of the inputterminal 131 and the ground terminal 132.

FIG. 3 is a transparent perspective view schematically illustrating acomposite electronic component according to a second exemplaryembodiment in the present disclosure.

FIG. 4 is a cross-sectional view taken along line A-A′ of FIG. 3.

Referring to FIGS. 3 and 4, in addition to features of the compositeelectronic component according to the first exemplary embodiment in thepresent disclosure, a composite electronic component according to asecond exemplary embodiment in the present disclosure may have a form inwhich the ESD protection device 120 is disposed on a lower surface ofthe ceramic body of the capacitor 110.

The ESD protection device 120 may be an ESD suppressor, but is notlimited thereto.

Therefore, a phenomenon in which vibrations of the capacitor due to aninverse piezoelectric feature of the capacitor 110 are transferred to aboard may be decreased to reduce acoustic noise.

A structure for reducing acoustic noise at the time of mounting thecomposite electronic component 100 on the board will be described inmore detail.

In order to avoid overlapping descriptions, detailed descriptions offeatures of a composite electronic component 100 according to the secondexemplary embodiment in the present disclosure, the same as those of thecomposite electronic component according to the first exemplaryembodiment in the present disclosure described above will be omitted.

FIG. 5 is an equivalent circuit diagram of the composite electroniccomponent shown in FIG. 3.

Referring to FIG. 5, in the composite electronic component according toan exemplary embodiment in the present disclosure, the capacitor 110 andthe ESD protection device 120 may be coupled to each other, unlike inthe case of the related art. Therefore, the capacitor 110 and the ESDprotection device 120 may be designed so as to have a relativelyshortest distance therebetween, whereby noise may be decreased.

In addition, the capacitor 110 and the ESD protection device 120 may becoupled to each other, such that a mounting area in the signalinterface, the IC block, or the communications line is significantlydecreased, excellent in terms of securing a mounting space.

In addition, costs required for mounting the composite electroniccomponent may be decreased.

FIG. 6 is a perspective view schematically illustrating a compositeelectronic component according to a third exemplary embodiment in thepresent disclosure.

FIG. 7 is a cross-sectional view taken along line A-A′ of FIG. 6.

Referring to FIGS. 6 and 7, a composite electronic component 200according to a third exemplary embodiment in the present disclosure mayinclude a composite body 230 including a capacitor 210 and an ESDprotection device 220 coupled to each other, the capacitor 210 includinga ceramic body in which a plurality of dielectric layers 211 and aplurality of first and second internal electrodes 221 and 222 disposedso as to face each other with a respective dielectric layer 211interposed therebetween are stacked, and the ESD protection device 220including a substrate 270, first and second electrodes 241 and 242disposed below the substrate 270 and insulated from each other, adischarging part 240 disposed between the first and second electrodes241 and 242, and a protective layer 250 disposed below the first andsecond electrodes 241 and 242 and the discharging part 240.

In addition, the composite electronic component 200 according to thethird exemplary embodiment in the present disclosure may include a firstexternal electrode 231 a disposed on a first end surface of the ceramicbody in the length direction and connected to the first internalelectrodes 221 of the capacitor 210, a second external electrode 232 adisposed on a second end surface of the ceramic body in the lengthdirection and connected to the second internal electrodes 222 of thecapacitor 210, a third external electrode 231 b disposed on a first endsurface of the ESD protection device 220 in the length direction andconnected to the first electrode 241, and a fourth external electrode232 b disposed on a second end surface of the ESD protection device 220in the length direction and connected to the second electrode 242.

In addition, the composite body 230 may include an input terminal 231configured of the first and third external electrodes 231 a and 231 bcoupled to each other and a ground terminal 232 configured of the secondand fourth external electrodes 232 a and 232 b coupled to each other.

The ESD protection device 220 may be an ESD suppressor, but is notlimited thereto.

The first external electrode 231 a may be formed on the first endsurface of the ceramic body in the length direction, but may also beextended to the third and fourth side surfaces of the ceramic body inthe width direction and the upper and lower surfaces of the ceramicbody.

The second external electrode 232 a may be formed on the second endsurface of the ceramic body in the length direction, but may also beextended to the third and fourth side surfaces of the ceramic body inthe width direction and the upper and lower surfaces of the ceramicbody.

The third external electrode 231 b may be formed on the first endsurface of the ESD protection device 220 in the length direction, butmay also be extended to the third and fourth side surfaces of the ESDprotection device 220 in the width direction and the upper and lowersurfaces of the ESD protection device 220.

The fourth external electrode 232 b may be formed on the second endsurface of the ESD protection device 220 in the length direction, butmay also be extended to the third and fourth side surfaces of the ESDprotection device 220 in the width direction and the upper and lowersurface of the ESD protection device 220.

The capacitor 210 and the ESD protection device 220 may be coupled toeach other by a conductive adhesive 260.

In the composite electronic component 200 according to the thirdexemplary embodiment of the present disclosure, since the capacitor 210and the ESD protection device 220, separately manufactured, arevertically coupled to each other, the conductive adhesive 260 may beapplied onto coupled surfaces of the capacitor 210 and the ESDprotection device 220 to couple the capacitor 210 and the ESD protectiondevice 220 to each other.

The conductive adhesive 260 is not particularly limited, but may be, forexample, a polymer paste containing silver (Ag).

According to the third exemplary embodiment in the present disclosure,at the time of vertically coupling the capacitor 210 and the ESDprotection device 220, separately manufactured, the first and secondelectrodes 241 and 242 and the discharging part 240 may be disposed soas to be spaced apart from the capacitor 210 as distant as possible.

For example, in the ESD protective layer 220 coupled to the capacitor210, the protective layer 250 may be disposed on the capacitor 210, andthe first and second electrodes 241 and 242 and the discharging part 240may be disposed on the protective layer 250.

Therefore, when the over-voltage such as ESD, or the like, is generatedin a state in which the composite electronic component is mounted on theboard, an effect of bypassing the over-voltage such as ESD, or the like,and protecting the capacitor 210 from the over-voltage through the firstand second electrodes 241 and 242 and the discharging part 240 may befurther improved.

However, the present disclosure is not limited thereto. For example, thefirst and second electrodes 241 and 242 and the discharging part 240 mayalso be disposed adjacent to the capacitor 210.

In the composite electronic component 200 according to the thirdexemplary embodiment in the present disclosure, since the capacitor 210and the ESD protection device 220 are separately manufactured andcoupled to each other unlike an integrated structure according to therelated art, a manufacturing process may be simple and there are nolimitations in selecting materials.

In detail, since the capacitor 210 and the ESD protection device 220 arecoupled to each other by the conductive adhesive 260, when theover-voltage such as ESD, or the like, is instantaneously generated, theover-voltage may be bypassed through the ESD protection device 220, suchthat influence of the over-voltage on the capacitor 210 may besignificantly decreased. Therefore, the capacitor 210 may be protected.

For example, since the capacitor 210 and the ESD protection device 220,separately manufactured, are coupled to each other by the conductiveadhesive 260, such that they are closely spaced apart from each other,the capacitor 210 may be protected from over-voltage such as ESD, or thelike.

In addition, plating layers 233 formed by plating may be disposed onouter portions of the input terminal 231 and the ground terminal 232.Here, the plating layer 233 is not particularly limited, but may be, forexample, a nickel/tin (Ni/Sn) plating layer.

The plating layers 233 may protect the input terminal 231 configured ofthe first and third external electrodes 231 a and 231 b coupled to eachother and the ground terminal 232 configured of the second and fourthexternal electrodes 232 a and 232 b coupled to each other and complementthe external electrodes of the capacitor and the ESD protection deviceso as to be coupled to each other to perform functions of input andground terminals.

The substrate 270 may be any substrate as long as the first and secondelectrodes 241 and 242 may be formed thereon. For example, the substrate270 may be an alumina substrate.

In order to avoid an overlapping description, a detailed description offeatures of a composite electronic component 200 according to the thirdexemplary embodiment in the present disclosure, the same as those of thecomposite electronic component according to the first exemplaryembodiment in the present disclosure described above will be omitted.

FIG. 8 is a transparent perspective view schematically illustrating acomposite electronic component according to a fourth exemplaryembodiment in the present disclosure.

FIG. 9 is a cross-sectional view taken along line A-A′ of FIG. 8.

Referring to FIGS. 8 and 9, in addition to features of the compositeelectronic component according to the third exemplary embodiment in thepresent disclosure, a composite electronic component 200 according to afourth exemplary embodiment in the present disclosure may have a form inwhich the ESD protection device 220 is disposed on a lower surface ofthe ceramic body of the capacitor 210.

The ESD protection device 220 may be an ESD suppressor, but is notlimited thereto.

According to the fourth exemplary embodiment in the present disclosure,at the time of coupling the separately manufactured ESD protectiondevice 220 to a lower surface of the ceramic body of the capacitor 210,the first and second electrodes 241 and 242 and the discharging part 240may be disposed so as to be spaced apart from the capacitor 210 by aslarge a distance as possible.

For example, in the ESD protection device 220 coupled to the capacitor210, the protective layer 250 may be disposed adjacently to thecapacitor 210, and the first and second electrodes 241 and 242 and thedischarging part 240 may be disposed below the protective layer 250.

Therefore, in the case in which an over-voltage such as ESD, or thelike, is generated in a state in which the composite electroniccomponent is mounted on the board, an effect of bypassing theover-voltage such as ESD, or the like, and protecting the capacitor 210from the over-voltage through the first and second electrodes 241 and242 and the discharging part 240 may be further improved.

However, the present disclosure is not limited thereto. For example, thefirst and second electrodes 241 and 242 and the discharging part 240 mayalso be disposed adjacently to the capacitor 210.

The ESD protection device 220 may be disposed on the lower surface ofthe ceramic body of the capacitor 210 to decrease a phenomenon in whichvibrations of the capacitor 210, due to an inverse piezoelectric featureof the capacitor 210, are transferred to the board, thereby decreasingacoustic noise.

A structure decreasing the acoustic noise at the time of mounting thecomposite electronic component 200 on the board will be described inmore detail.

Meanwhile, a composite electronic component according to anotherexemplary embodiment in the present disclosure may include a compositebody in which a noise filter unit and an ESD protection device disposedbelow the noise filter unit are coupled to each other; and an inputterminal and a ground terminal coupled to the composite body, and thenoise filter unit filters a noise component of an input signal input tothe input terminal, and the ESD protection device bypasses anover-voltage input to the input terminal.

The composite electronic component according to another exemplaryembodiment in the present disclosure will be described in more detailwith the accompanying drawings.

FIG. 10 is a view illustrating a signal interface through which signalsare transferred from a connector to a system or an integrated circuit(IC).

Referring to FIG. 10, the signal interface through which the signals aretransferred from the connector to the system or the IC may include aconnector 300 such as an output terminal Vdd, a signal unit Signals, orthe like, a signal stabilizing unit 400, and a system or an IC 500.

The connector 300 may supply the signals to the signal stabilizing unit400. The signals may have a rated voltage and current and may betransferred to the system or the IC 500.

The connector 300 may be the output terminal Vdd, a signal input andoutput terminal Signal+ and Signal−, or a ground terminal, but is notlimited thereto.

The signal stabilizing unit 400 may include a noise filter unitfiltering noise components in the signals input from the connector 300and an ESD protection device bypassing an over-voltage.

In detail, the signal stabilizing unit 400 may include capacitors C1 toC3 filtering the noise components in the input signals and bypassing aportion of the over-voltage, and ESD protection devices E1 to E3.

Although the case in which the number of capacitors C1 to C3 filteringthe noise components in the input signals and bypassing a portion of theover-voltage, and the number of the ESD protection devices E1 to E3 are3, respectively, has been shown in FIG. 10, the numbers of capacitors C1to C3 and the ESD protection devices E1 to E3 are not limited thereto,but may be adjusted, as necessary.

In addition, the capacitors C1 to C3, which serve to filter noisecomponents and bypass a portion of the over-voltage, may below-capacitance capacitors having a capacitance of 100 pF to 1 nF.

The capacitors C1 to C3 may bypass a portion of the over-voltage, andthe majority of the over-voltage may be bypassed through the ESDprotection devices E1 to E3.

The signals input from the connector 300 pass through the stabilizingunit 400, such that the noise component of the signals may be filteredand the over-voltage, or the like, that may be instantaneously generatedmay be bypassed. Then, the signals from which the noise components arefiltered and of which the over-voltage, or the like, is bypassed may betransferred to the system or the IC 500.

FIG. 11 is a view illustrating a device layout pattern between theconnector and the system or the IC.

Referring to FIG. 11, disposition patterns of the connector 300 such asthe output terminal Vdd, the signal unit Signals, or the like, thesignal stabilizing unit 400, and the system or the IC 500 may beconfirmed.

Generally, the connector 300 such as the output terminal Vdd, the signalunit Signals, or the like, and the system or the IC 500 may includeseveral capacitors to several tens of capacitors or several ESDprotection devices to several tens of ESD protection devices disposedtherebetween.

Referring to FIG. 11, the connector 300 such as the output terminal Vdd,the signal unit Signals, or the like, may have predetermined terminalsN1 and N2. The connector 300 such as the output terminal Vdd, the signalunit Signals, or the like, may supply power or the signals through thefirst and second terminals N1 and N2.

Here, the capacitor C1 may receive power or the signals through thefirst and second terminals N1 and N2, stabilize the received power andsignals, and transfer the stabilized power and signals to the system orthe IC 500.

In addition, the capacitor C1 and the ESD protection device E1 maybypass the over-voltage such as ESD, or the like, to a ground through athird terminal N3.

It needs to be importantly considered in designing patterns of thesignal interface, the IC block, or the communications line that thecapacitor, the ESD protection device, the IC, and the like, are to bedisposed as closely to each other as possible.

The reason may be that the requirements as described above need to besatisfied in order to reduce the area of a component and suppressgeneration of noise.

In the case in which the capacitor and ESD protection device aredisposed in a non-optimal state, the distance between the capacitor andESD protection device and a power line may be increased, such that noisemay occur. The noise may have a negative influence on the system or theIC.

FIG. 12 is a circuit diagram of the composite electronic componentaccording to an exemplary embodiment in the present disclosure.

Referring to FIG. 12, the composite electronic component 400 may includean input terminal unit A (input terminal), a signal stabilizing unit,and a ground terminal unit B (ground terminal).

The signal stabilizing unit may include a capacitor C1 and an ESDprotection device E1.

The composite electronic component 400 may perform a function of thesignal stabilizing unit described above.

The input terminal unit A may receive the signals from the connector 300such as the output terminal Vdd, or the like.

The signal stabilizing unit may remove noise of the signals receivedfrom the input terminal unit A and bypass an over-voltage, or the like.

The ground terminal unit B may connect the signal stabilizing unit to aground.

For example, the composite electronic component 400 may allow thecapacitor and the ESD protection device provided between the connector300 such as the output terminal Vdd, the signal unit Signals, or thelike, and the system or the IC 500 to be implemented as a singlecomponent. Therefore, the degree of integration of devices may beimproved due to the composite electronic component 400.

FIG. 13 is a view illustrating a device layout pattern in which thecomposite electronic components according to an exemplary embodiment ofthe present disclosure are used between the connector and the system orthe IC.

Referring to FIG. 13, it may be confirmed that the capacitors C1 and C2and the ESD protection devices E1 and E2 shown in FIG. 11 are replacedby the composite electronic components according to an exemplaryembodiment in the present disclosure.

In addition, the composite electronic component may perform functions ofthe signal stabilizing unit such as filtering noise, bypassing anover-voltage such as ESD, and the like.

In addition, the capacitors C1 and C2 and the ESD protection devices E1and E2 are replaced by the composite electronic components according toan exemplary embodiment in the present disclosure, whereby length ofwiring may be significantly decreased. In addition, the number ofdevices disposed is decreased, whereby the devices may be properlydisposed.

Meanwhile, electronic apparatus manufacturers have made an effort toreduce the size of a printed circuit board (PCB) included in anelectronic apparatus in order to satisfy consumer demand. Therefore, ithas been required to increase the degree of integration of ICs mountedon the PCB. As in the composite electronic component according to anexemplary embodiment in the present disclosure, a plurality of devicesare implemented as a single composite component, whereby this demand maybe satisfied.

Further, according to an exemplary embodiment in the present disclosure,two components (capacitor and ESD protection device) are implemented asa single composite electronic component, whereby the area in which theyare mounted on the PCB may be reduced. According to an exemplaryembodiment in the present disclosure, the area in which components aremounted may be reduced as compared with an existing disposition patternby about 50% or more.

In addition, the composite electronic component according to anexemplary embodiment in the present disclosure may be used in a highspeed data line, a universal serial bus (USB) 3.0 or higher line, a highdefinition multimedia interface (HDMI) line, and the like, and may beused in a cable interconnecting electronic boards or an external port inproducts configuring electronic boards, for example, in vehicles,television (TV) sets, and the like.

Since this application has a high data rate, a very high reaction speed,and a high frequency band, the ESD protection device needs to beappropriate.

For example, in the composite electronic component according to anexemplary embodiment in the present disclosure, the ESD protectiondevice may be an ESD suppressor that may be used in the high speed dataline, the USB 3.0 or higher line, the HDMI line, and an external porthaving a high data rate, a very high reaction speed, and a highfrequency band.

Method of Manufacturing Composite Electronic Component

A method of manufacturing a composite electronic component according toanother exemplary embodiment in the present disclosure may includepreparing a capacitor configured of a ceramic body in which a pluralityof dielectric layers and internal electrodes disposed so as to face eachother with a respective dielectric layer interposed therebetween arestacked; forming first and second electrodes on the ceramic body so asto be insulated from each other; applying a paste containing aconductive polymer between the first and second electrodes to prepare adischarging part; applying an insulating resin onto the first and secondelectrodes and the discharging part to prepare an ESD protection device;and forming an input terminal and a ground terminal on both end surfacesof a composite body in a length direction, respectively, the compositebody being formed by coupling the capacitor configured of the ceramicbody and the ESD protection device formed on the ceramic body to eachother.

Hereinafter, the method of manufacturing a composite electroniccomponent according to another exemplary embodiment in the presentdisclosure will be described. However, the present disclosure is notlimited thereto.

In the method of manufacturing a composite electronic component, thecapacitor configured of the ceramic body in which the plurality ofdielectric layers and the internal electrodes disposed so as to faceeach other with a respective dielectric layer interposed therebetweenare stacked may be first prepared.

A method of preparing the capacitor configured of the ceramic body isnot particularly limited, but may be the same as a general method ofmanufacturing a capacitor.

For example, a slurry containing a powder such as barium titanate(BaTiO₃) powder, or the like, having an average particle size of 0.5 μmor less may be applied and dried on carrier films to prepare a pluralityof ceramic green sheets.

Next, a conductive paste for an internal electrode containing nickelpowder particles having an average particle size of 0.5 μm or less maybe prepared.

The conductive paste for an internal electrode may be prepared by addingbarium titanate (BaTiO₃) powder separately from, and in addition to, anickel powder.

The a conductive paste for an internal electrode may be applied onto theceramic green sheets by a screen printing method to form the internalelectrodes, and 100 to 300 ceramic green sheets on which the internalelectrodes are formed may be stacked to form a multilayer body.

Then, the multilayer body may be compressed and cut to manufacture achip having a necessary size, thereby preparing a ceramic body.

Next, the first and second electrodes may be formed on the ceramic bodyso as to be insulated from each other.

This process of forming the first and second electrodes is notparticularly limited, but may be performed by, for example, a printingmethod using a paste containing a metal such as copper (Cu), or thelike.

Shapes of the first and second electrodes are not particularly limited,but may be the same as those of the internal electrodes in the ceramicbody.

The first and second internal electrodes may be formed on the sameplane, may be exposed to first and second end surfaces of the ESDprotection device in the length direction, respectively, and may beinternally spaced apart from each other to thereby be insulated fromeach other.

Next, the paste containing the conductive polymer may be applied betweenthe first and second electrodes to prepare the discharging part.

This process of applying the paste containing the conductive polymerbetween the first and second electrodes is not particularly limited, butmay be performed by a printing method.

Next, the insulating resin may be applied onto the first and secondelectrodes and the discharging part to prepare the ESD protectiondevice.

The insulating resin may be any material that may protect the first andsecond electrodes and the discharging part from the outside, and forexample, may be an epoxy based resin.

Next, the input terminal and the ground terminal may be formed on bothend surfaces of the composite body in the length direction thereof,respectively, and the composite body is formed by coupling the capacitorincluding the ceramic body and the ESD protection device formed on theceramic body to each other.

The input terminal may be formed on the first end surface of thecomposite body in the length direction, and the ground terminal may beformed on the second end surface thereof in the length direction.

A process of forming the input terminal and the ground terminal may beperformed by applying a conductive paste containing a metal such ascopper (Cu), or the like, and a conductive paste containing aninsulating material such as glass, or the like onto both end surfaces ofthe composite body in the length direction.

The process of forming the input terminal and the ground terminal may beperformed by a dipping method or a printing method, but is not limitedthereto.

Next, plating layers may be formed on the input terminal and the groundterminal by a method such as a plating method, or the like, tomanufacture the composite electronic component.

The plating layers are not particularly limited, but may be, forexample, nickel/tin (Ni/Sn) plating layers.

Board for Mounting of Composite Electronic Component

FIG. 14 is a perspective view illustrating a manner in which thecomposite electronic component of FIG. 8 is mounted on a printed circuitboard.

Referring to FIG. 14, a board 600 for mounting of a composite electroniccomponent 200 according to the exemplary embodiment in the presentdisclosure may include a printed circuit board 610 on which thecomposite electronic component 200 is mounted and two electrode pads 621and 622 disposed on an upper surface of the printed circuit board 610.

The electrode pads 621 and 622 may be first and second electrode pads621 and 622 connected to the input terminal 231 and the ground terminal232 of the composite electronic component, respectively.

Here, the input terminal 231 and the ground terminal 232 of thecomposite electronic component 200 may be electrically connected to theprinted circuit board 610 by solder 630 in a state in which they arepositioned on the first and second electrode pads 621 and 622,respectively, so as to contact the first and second electrode pads 621and 622, respectively.

When a voltage is applied to the composite electronic component 200 in astate in which the composite electronic component 200 is mounted on theprinted circuit board 610, acoustic noise may occur.

Here, sizes of the first and second electrode pads 621 and 622 maybecome indices in determining the amount of solder 630 connecting theinput terminal 231 and the ground terminal 232 of the compositeelectronic component 200 and the first and second electrode pads 621 and622 to each other, respectively, and the magnitude of the acoustic noisemay be adjusted depending on the amount of solder 630.

Meanwhile, when voltages having different polarities are applied to theinput terminal 231 and the ground terminal 232 formed on both endsurfaces of the composite electronic component 200 in the lengthdirection, respectively, in a state in which the composite electroniccomponent 200 is mounted on the printed circuit board 610, the ceramicbody may be expanded and contracted in the thickness direction due to aninverse piezoelectric effect of the dielectric layers 211, and both endportions of the input terminal 231 and the ground terminal 232 in thelength direction may be contracted and expanded in directions oppositeto the expansion and contraction directions of the ceramic body in thethickness direction, due to the Poisson effect.

Here, in the composite electronic component according to an exemplaryembodiment in the present disclosure, the ESD protection device isdisposed on the lower surface of the ceramic body of the capacitor toreduce the phenomenon in which vibrations of the capacitor due to theinverse piezoelectric feature of the capacitor are transferred to theboard at the time of mounting the composite electronic component on theboard, whereby acoustic noise may be reduced.

In addition, in the composite electronic component according to anexemplary embodiment in the present disclosure, the ESD protectiondevice is disposed on the lower surface of the ceramic body of thecapacitor, such that the capacitor may be disposed at a distance distantfrom the board, whereby the capacitor may be protected even thoughcracks, or the like, occur in the composite electronic component.

Further, in the composite electronic component according to an exemplaryembodiment in the present disclosure, the ESD protection device isdisposed on the lower surface of the ceramic body of the capacitor, suchthat the distance between the ESD protection device and the board isclose to reduce parasitic pattern resistance or parasitic inductance,whereby a side effect may be reduced.

For example, the parasitic pattern resistance or the parasiticinductance may be reduced, whereby frequency characteristics may beimproved and characteristics of the composite electronic componentfiltering a noise component without distorting signals and bypassing aportion of an over-voltage may be improved.

Packaging Unit of Composite Electronic Component

FIG. 15 is a schematic perspective view illustrating a manner in whichthe composite electronic components of FIG. 8 are mounted in a packagingunit.

FIG. 16 is a schematic cross-sectional view illustrating a packagingunit of FIG. 15 coiled in a coil shape.

Referring to FIG. 15, a packaging unit 700 of a composite electroniccomponent according to the exemplary embodiment in the presentdisclosure may include a packaging sheet 720 having receiving parts 724formed therein, the receiving parts 724 receiving the compositeelectronic components 200 therein.

The receiving parts 724 of the packaging sheet 720 may have shapescorresponding to those of the composite electronic components 200, andthe internal electrodes may be disposed horizontally, based on bottomsurfaces 725 of the receiving parts 724.

In detail, respective composite electronic components 200 received inthe receiving parts 724 may be disposed so that the ESD protectiondevice 220 thereof is directed toward the bottom surface of thereceiving part 724.

The composite electronic components 200 may be maintained in a state inwhich the internal electrodes thereof are horizontally aligned with eachother through an electronic component aligning apparatus and be moved tothe packaging sheet 720 through a transferring apparatus.

Therefore, respective composite electronic components 200 received inthe receiving parts 724 may be disposed so that the ESD protectiondevice 220 thereof is directed toward the bottom surface of thereceiving part 724.

Through such a method, a plurality of composite electronic components200 in the packaging sheet 720 may be disposed to have the samedirectionality in the packaging sheet 720.

The packaging unit 700 of the composite electronic component may furtherinclude a packaging film 740 covering the packaging sheet 720 in whichthe composite electronic components 200 having the internal electrodesdisposed horizontally based on the bottom surfaces of the receivingparts 724 and the ESD protection devices 220 disposed so as to bedirected toward the bottom surfaces of the receiving parts 724 arereceived.

The packaging unit 700 of a composite electronic component coiled in thecoil shape shown in FIG. 16 may be obtained through continuous coilingoperation.

As set forth above, according to exemplary embodiments in the presentdisclosure, the composite electronic component capable of being mountedin a reduced area may be provided.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the spirit and scope ofthe present disclosure as defined by the appended claims.

What is claimed is:
 1. A composite electronic component comprising: acomposite body including a capacitor and an electrostatic discharge(ESD) protection device coupled to each other, the capacitor including aceramic body in which a plurality of dielectric layers and internalelectrodes are stacked with a respective dielectric layer interposedbetween the internal electrodes, and the ESD protection device includingfirst and second electrodes disposed on the ceramic body, a dischargingpart disposed between the first and second electrodes, and a protectivelayer disposed on the first and second electrodes and the dischargingpart; an input terminal disposed on a first end surface of the compositebody in a length direction of the composite body and connected tointernal electrodes of the capacitor and the first electrode; and aground terminal disposed on a second end surface of the composite bodyin the length direction and connected to internal electrodes of thecapacitor and the second electrode.
 2. The composite electroniccomponent of claim 1, wherein the ESD protection device is disposed on alower surface of the ceramic body.
 3. The composite electronic componentof claim 1, wherein the first and second electrodes face each other onthe same plane.
 4. The composite electronic component of claim 1,wherein the discharging part includes a conductive polymer.
 5. Thecomposite electronic component of claim 1, wherein the protective layerincludes an epoxy based resin.
 6. A composite electronic componentcomprising: a composite body including a capacitor and an ESD protectiondevice coupled to each other, the capacitor including a ceramic body inwhich a plurality of dielectric layers and a plurality of first andsecond internal electrodes are stacked with a respective dielectriclayer interposed between the first and second internal electrodes, andthe ESD protection device including a substrate, first and secondelectrodes disposed below the substrate and insulated from each other, adischarging part disposed between the first and second electrodes, and aprotective layer disposed below the first and second electrodes and thedischarging part; a first external electrode disposed on a first endsurface of the ceramic body in a length direction of the ceramic bodyand connected to the first internal electrodes of the capacitor and asecond external electrode disposed on a second end surface of theceramic body in the length direction and connected to the secondinternal electrodes of the capacitor; and a third external electrodedisposed on a first end surface of the ESD protection device in thelength direction and connected to the first electrode and a fourthexternal electrode disposed on a second end surface of the ESDprotection device in the length direction and connected to the secondelectrode, wherein the composite body includes an input terminalincluding the first and third external electrodes coupled to each otherand a ground terminal including the second and fourth externalelectrodes coupled to each other, the capacitor and the ESD protectiondevice are coupled to each other by a conductive adhesive, and platinglayers are disposed on outer portions of the input terminal and theground terminal.
 7. The composite electronic component of claim 6,wherein the ESD protection device is disposed on a lower surface of thecapacitor.
 8. The composite electronic component of claim 6, wherein thefirst and second electrodes face each other on the same plane.
 9. Thecomposite electronic component of claim 6, wherein the discharging partincludes a conductive polymer.
 10. The composite electronic component ofclaim 6, wherein the protective layer includes an epoxy based resin. 11.A composite electronic component comprising: a composite body in which anoise filter unit and an ESD protection device disposed below the noisefilter unit are coupled to each other; and an input terminal and aground terminal coupled to the composite body, wherein the noise filterunit is configured to filter a noise component of an input signal inputto the input terminal, and the ESD protection device bypasses anover-voltage input beyond a rated voltage applied to the input terminal.12. The composite electronic component of claim 11, wherein the ESDprotection device includes first and second electrodes, a dischargingpart disposed between the first and second electrodes, and a protectivelayer disposed on the first and second electrodes and the dischargingpart.
 13. The composite electronic component of claim 12, wherein theESD protection device bypasses the over-voltage input applied to theinput terminal by enabling the discharging part to be in a conductivestate.
 14. The composite electronic component of claim 12, wherein thefirst and second electrodes face each other on the same plane.
 15. Thecomposite electronic component of claim 12, wherein the discharging partincludes a conductive polymer.
 16. The composite electronic component ofclaim 12, wherein the protective layer includes an epoxy based resin.17. The composite electronic component of claim 11, wherein the ESDprotection device is an ESD suppressor.
 18. A method of manufacturing acomposite electronic component, comprising: preparing a capacitorincluding a ceramic body in which a plurality of dielectric layers andinternal electrodes are stacked with a respective dielectric layerinterposed between the internal electrodes; forming first and secondelectrodes on the ceramic body so as to be insulated from each other;applying a paste containing a conductive polymer between the first andsecond electrodes to prepare a discharging part; applying an insulatingresin onto the first and second electrodes and the discharging part toprepare an ESD protection device; and forming an input terminal and aground terminal on both end surfaces of a composite body in a lengthdirection of the composite body, respectively, the composite body beingformed by coupling to each other the capacitor including the ceramicbody and the ESD protection device formed on the ceramic body.
 19. Themethod of manufacturing a composite electronic component of claim 18,wherein the forming of the first and second electrodes is performed by aprinting method.
 20. The method of manufacturing a composite electroniccomponent of claim 18, wherein the applying of the paste containing theconductive polymer between the first and second electrodes is performedby a printing method.
 21. The method of manufacturing a compositeelectronic component of claim 18, wherein the insulating resin is anepoxy based resin.
 22. A board for mounting of a composite electroniccomponent, comprising: a printed circuit board on which a plurality ofelectrode pads are disposed; the composite electronic component of claim1 installed on the printed circuit board; and a solder connecting theelectrode pads and the composite electronic component to each other. 23.A board for mounting of a composite electronic component, comprising: aprinted circuit board on which a plurality of electrode pads aredisposed; the composite electronic component of claim 6 installed on theprinted circuit board; and a solder connecting the electrode pads andthe composite electronic component to each other.
 24. A board formounting of a composite electronic component, comprising: a printedcircuit board on which a plurality of electrode pads are disposed; thecomposite electronic component of claim 11 installed on the printedcircuit board; and a solder connecting the electrode pads and thecomposite electronic component to each other.
 25. A packaging unit of acomposite electronic component, comprising: the composite electroniccomponent of claim 1; and a packaging sheet having a receiving part, thereceiving parts receiving the composite electronic component, whereinthe internal electrodes are disposed horizontally based on bottomsurfaces of the receiving part and are aligned with each other.
 26. Thepackaging unit of a composite electronic component of claim 25, whereinthe respective composite electronic component received in the receivingpart is disposed so that the ESD protection device is directed towardthe bottom surface of the receiving part.
 27. The packaging unit of acomposite electronic component of claim 25, further comprising apackaging film coupled to the packaging sheet and covering the compositeelectronic components.
 28. The packaging unit of a composite electroniccomponent of claim 25, wherein the packaging sheet in which thecomposite electronic components are received is coiled in a coil shape.29. A packaging unit of a composite electronic component, comprising:the composite electronic component of claim 6; and a packaging sheethaving a receiving part, the receiving parts receiving the compositeelectronic component, wherein the internal electrodes are disposedhorizontally based on bottom surfaces of the receiving part and arealigned with each other.
 30. The packaging unit of a compositeelectronic component of claim 29, wherein the respective compositeelectronic component received in the receiving part is disposed so thatthe ESD protection device is directed toward the bottom surface of thereceiving part.
 31. The packaging unit of a composite electroniccomponent of claim 29, further comprising a packaging film coupled tothe packaging sheet and covering the composite electronic components.32. The packaging unit of a composite electronic component of claim 29,wherein the packaging sheet in which the composite electronic componentsare received is coiled in a coil shape.
 33. A composite electroniccomponent comprising: a capacitor having a body in which are locatedinternal electrodes separated by dielectric material; an electrostaticdischarge (ESD) protection device disposed on the body of the capacitorand having electrodes coupled to the internal electrodes of thecapacitor, the ESD having a discharge part and first and secondelectrodes at opposite portions of the discharge part; and input andground terminals coupled to the first and second electrodes of the ESD.34. The composite electronic component of claim 33, wherein thecapacitor has a ceramic body on which the ESD is disposed.
 35. Thecomposite electronic component of claim 34, wherein the first and secondelectrodes of the ESD are disposed on the ceramic body.
 36. Thecomposite electronic component of claim 35, including a protective layerdisposed on the first and second electrodes and the discharging part ofthe ESD.
 37. The composite electronic component of claim 36, in whichthe capacitor comprises a plurality of dielectric layers, and internalelectrodes are stacked with respective dielectric layers interposedbetween internal electrodes.